Main Markets
Semiconductor & Microchip fabrication
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Diamond band saw to size silicon (Si) & silicon carbide (SiC) bricks
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Surface grinding and chamfering of Si & SiC blocks using diamond resin bond wheels
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Diamond wire saw & wheels for Si & SiC wafer slicing & edge grinding, and back side grinding with resin and vitrified bond wheels
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Diamond metal and resin bond cutting blades for micro die cutting
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Diamond resin bond wheels for surface grinding of LED Sapphire wafer
Electronic Components
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Abrasives wheels for slicing and dicing read-write heads
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Abrasives products for grinding, polishing casing & glass screen
